How many transistors in an iphone

Processor Transistor count Year Constructor Process
(nm) Area (mm ² ) Transistor
density
(tr./mm ² ) MP944 (20-bit, 6-chip, 28 pause total) 74,442 (5,360 excl. ROM & RAM) ^{[14] [15]} 1970 ^{[12] [a]} Garrett AiResearch ? ? ? Intel 4004 (4-bit, 16-pin) 2,250 1971 Intel 10,000 nm 12 mm ² 188 TMX 1795 (8-bit, 24-pin) 3,078 ^[16] 1971 Texas Instruments ? 30.64 mm ² 100.5 Intel 8008 (8-bit, 18-pin) 3,500 1972 Intel 10,000 nm 14 mm ² 250 NEC μCOM-4 (4-bit, 42-pin) 2,500 ^{[17] [18]} 1973 NEC 7,500 nm ^[19] ? ? Toshiba TLCS-12 (12-bit) 11,000+ ^[20] 1973 Toshiba 6,000 nm 32.45 mm ² 340+ Intel 4040 (4-bit, 16-pin) 3,000 1974 Intel 10,000 nm 12 mm ² 250 Motorola 6800 (8-bit, 40-pin) 4,100 1974 Motorola 6,000 nm 16 mm ² 256 Intel 8080 (8-bit, 40-pin) 6,000 1974 Intel 6,000 nm 20 mm ² Ccc TMS 1000 (4-bit, 28-pin) 8,000 ^[b] 1974 ^[21] Texas Instruments 8,000 nm 11 mm ² 730 MOS Technology 6502 (8-bit, 40-pin) 4,528 ^{[c] [22]} 1975 Influence Technology 8,000 nm 21 mm ² 216 Intersil IM6100 (12-bit, 40-pin; clone of PDP-8 ) 4,000 1975 Intersil ? ? ? CDP 1801 (8-bit, 2-chip, 40-pin) 5,000 1975 RCA ? ? ? RCA 1802 (8-bit, 40-pin) 5,000 1976 RCA 5,000 nm 27 mm ² 185 Zilog Z80 (8-bit, 4-bit ALU, 40-pin) 8,500 ^[d] 1976 Zilog 4,000 nm 18 mm ² 470 Intel 8085 (8-bit, 40-pin) 6,500 1976 Intel 3,000 nm 20 mm ² 325 TMS9900 (16-bit) 8,000 1976 Texas Instruments ? ? ? Bellmac-8 (8-bit) 7,000 1977 Bell Labs 5,000 nm ? ? Motorola 6809 (8-bit with some 16-bit features , 40-pin) 9,000 1978 Motorola 5,000 nm 21 mm ² 430 Intel 8086 (16-bit, 40-pin) 29,000 ^[23] 1978 Intel 3,000 nm 33 mm ² 880 Zilog Z8000 (16-bit) 17,500 ^[24] 1979 Zilog ? ? ? Intel 8088 (16-bit, 8-bit data bus) 29,000 1979 Intel 3,000 nm 33 mm ² 880 Motorola 68000 (16/32-bit, 32-bit registers, 16-bit ALU ) 68,000 ^[25] 1979 Motorola 3,500 nm 44 mm ² 1,550 Intel 8051 (8-bit, 40-pin) 50,000 1980 Intel ? ? ? WDC 65C02 11,500 ^[26] 1981 WDC 3,000 nm 6 mm ² 1,920 ROMP (32-bit) 45,000 1981 IBM 2,000 nm 58.52 mm ² 770 Intel 80186 (16-bit, 68-pin) 55,000 1982 Intel 3,000 nm 60 mm ² 920 Intel 80286 (16-bit, 68-pin) 134,000 1982 Intel 1,500 nm 49 mm ² 2,730 WDC 65C816 (8/16-bit) 22,000 ^[27] 1983 WDC 3,000 nm ^[28] 9 mm ² 2,400 NEC V20 63,000 1984 NEC ? ? ? Motorola 68020 (32-bit; 114 pins used) 190,000 ^[29] 1984 Motorola 2,000 nm 85 mm ² 2,200 Intel 80386 (32-bit, 132-pin; no cache) 275,000 1985 Intel 1,500 nm 104 mm ² 2,640 ARM 1 (32-bit; clumsy cache) 25,000 ^[29] 1985 Acorn 3,000 nm 50 mm ² 500 Novix NC4016 (16-bit) 16,000 ^[30] 1985 ^[31] Harris Close-together 3,000 nm ^[32] ? ? SPARC MB86900 (32-bit; no cache) 110,000 ^[33] 1986 Fujitsu 1,200 nm ? ? NEC V60 ^[34] (32-bit; no cache) 375,000 1986 NEC 1,500 nm ? ? ARM 2 (32-bit, 84-pin; no cache) 27,000 ^{[35] [29]} 1986 Acorn 2,000 nm 30.25 mm ² 890 Z80000 (32-bit; very little cache) 91,000 1986 Zilog ? ? ? NEC V70 ^[34] (32-bit; no cache) 385,000 1987 NEC 1,500 nm ? ? Hitachi Gmicro/200 ^[36] 730,000 1987 Hitachi 1,000 nm ? ? Motorola 68030 (32-bit, very small caches) 273,000 1987 Motorola 800 nm 102 mm ² 2,680 TI Explorer's 32-bit Lispmachine chip 553,000 ^[37] 1987 Texas Instruments 2,000 nm ^[38] ? ? DEC WRL MultiTitan 180,000 ^[39] 1988 DEC WRL 1,500 nm 61 mm ² 2,950 Intel i960 (32-bit, 33-bit memory subsystem , no cache) 250,000 ^[40] 1988 Intel 1,500 nm ^[41] ? ? Intel i960CA (32-bit, cache) 600,000 ^[41] 1989 Intel 800 nm 143 mm ² 4,200 Intel i860 (32/64-bit, 128-bit SIMD, cache, VLIW) 1,000,000 ^[42] 1989 Intel ? ? ? Intel 80486 (32-bit, 8 KB cache) 1,180,235 1989 Intel 1,000 nm 173 mm ² 6,822 Embitter 3 (32-bit, 4 KB cache) 310,000 1989 Acorn 1,500 nm 87 mm ² 3,600 POWER1 (9-chip module, 72 kB of cache) 6,900,000 ^[43] 1990 IBM 1,000 nm 1,283.61 mm ² 5,375 Motorola 68040 (32-bit, 8 KB caches) 1,200,000 1990 Motorola 650 nm 152 mm ² 7,900 R4000 (64-bit, 16 KB of caches) 1,350,000 1991 Unit 1,000 nm 213 mm ² 6,340 Displeasing 6 (32-bit, no supply for this 60 variant) 35,000 1991 ARM 800 nm ? ? Hitachi SH-1 (32-bit, no cache) 600,000 ^[44] 1992 ^[45] Hitachi 800 nm 100 mm ² 6,000 Intel i960CF (32-bit, cache) 900,000 ^[41] 1992 Intel ? 125 mm ² 7,200 Alpha 21064 (64-bit, 290-pin; 16 KB of caches) 1,680,000 1992 DEC 750 nm 233.52 mm ² 7,190 Hitachi HARP-1 (32-bit, cache) 2,800,000 ^[46] 1993 Hitachi 500 nm 267 mm ² 10,500 Pentium (32-bit, 16 KB of caches) 3,100,000 1993 Intel 800 nm 294 mm ² 10,500 POWER2 (8-chip module, 288 kB of cache) 23,037,000 ^[47] 1993 IBM 720 nm 1,217.39 mm ² 18,923 ARM700 (32-bit; 8 KB cache) 578,977 ^[48] 1994 ARM 700 nm 68.51 mm ² 8,451 MuP21 (21-bit, ^[49] 40-pin; includes video) 7,000 ^[50] 1994 Offete Enterprises 1,200 nm ? ? Motorola 68060 (32-bit, 16 KB of caches) 2,500,000 1994 Motorola 600 nm 218 mm ² 11,500 PowerPC 601 (32-bit, 32 KB of caches) 2,800,000 ^[51] 1994 Apple, IBM, Motorola 600 nm 121 mm ² 23,000 PowerPC 603 (32-bit, 16 KB of caches) 1,600,000 ^[52] 1994 Apple, IBM, Motorola 500 nm 84.76 mm ² 18,900 PowerPC 603e (32-bit, 32 KB of caches) 2,600,000 ^[53] 1995 Apple, IBM, Motorola 500 nm 98 mm ² 26,500 Alpha 21164 EV5 (64-bit, 112 kB cache) 9,300,000 ^[54] 1995 DEC 500 nm 298.65 mm ² 31,140 SA-110 (32-bit, 32 KB of caches) 2,500,000 ^[29] 1995 Acorn, DEC, Apple 350 nm 50 mm ² 50,000 Pentium Pro (32-bit, 16 KB of caches; ^[55] L2 cache on-package, however on separate die) 5,500,000 ^[56] 1995 Intel 500 nm 307 mm ² 18,000 PA-8000 64-bit, rebuff cache 3,800,000 ^[57] 1995 HP 500 nm 337.69 mm ² 11,300 Entirety 21164A EV56 (64-bit, 112 kB cache) 9,660,000 ^[58] 1996 DEC 350 nm 208.8 mm ² 46,260 AMD K5 (32-bit, caches) 4,300,000 1996 AMD 500 nm 251 mm ² 17,000 Pentium II Klamath (32-bit, 64-bit SIMD, caches) 7,500,000 1997 Intel 350 nm 195 mm ² 39,000 AMD K6 (32-bit, caches) 8,800,000 1997 AMD 350 nm 162 mm ² 54,000 F21 (21-bit; includes e.g. video) 15,000 1997 ^[50] Offete Enterprises ? ? ? AVR (8-bit, 40-pin; w/memory) 140,000 (48,000
excl. memory ^[59] ) 1997 Germanic VLSI/Atmel ? ? ? Pentium II Deschutes (32-bit, large cache) 7,500,000 1998 Intel 250 nm 113 mm ² 66,000 Alpha 21264 EV6 (64-bit) 15,200,000 ^[60] 1998 DEC 350 nm 313.96 mm ² 48,400 Alpha 21164PC PCA57 (64-bit, 48 kB cache) 5,700,000 1998 Samsung 280 nm 100.5 mm ² 56,700 Hitachi SH-4 (32-bit, caches) ^[61] 3,200,000 ^[62] 1998 Hitachi 250 nm 57.76 mm ² 55,400 ARM 9TDMI (32-bit, no cache) 111,000 ^[29] 1999 Acorn 350 nm 4.8 mm ² 23,100 Pentium III Katmai (32-bit, 128-bit SIMD, caches) 9,500,000 1999 Intel 250 nm 128 mm ² 74,000 Feeling Engine (64-bit, 128-bit SIMD, cache) 10,500,000 ^[63]
– 13,500,000 ^[64] 1999 Sony, Toshiba 250 nm 239.7 mm ^{2 [63]} 43,800 – 56,300 Pentium II Mobile Dixon (32-bit, caches) 27,400,000 1999 Intel 180 nm 180 mm ² 152,000 AMD K6-III (32-bit, caches) 21,300,000 1999 AMD 250 nm 118 mm ² 181,000 AMD K7 (32-bit, caches) 22,000,000 1999 AMD 250 nm 184 mm ² 120,000 Gekko (32-bit, large cache) 21,000,000 ^[65] 2000 IBM, Nintendo 180 nm 43 mm ² 490,000 (check) Pentium III Coppermine (32-bit, large cache) 21,000,000 2000 Intel 180 nm 80 mm ² 263,000 Pentium 4 Willamette (32-bit, large cache) 42,000,000 2000 Intel 180 nm 217 mm ² 194,000 SPARC64 V (64-bit, considerable cache) 191,000,000 ^[66] 2001 Fujitsu 130 nm ^[67] 290 mm ² 659,000 Pentium III Tualatin (32-bit, large cache) 45,000,000 2001 Intel 130 nm 81 mm ² 556,000 Pentium 4 Northwood (32-bit, chunky cache) 55,000,000 2002 Intel 130 nm 145 mm ² 379,000 Itanium 2 President (64-bit, large cache) 220,000,000 2002 Intel 180 nm 421 mm ² 523,000 Beginning 21364 (64-bit, 946-pin, SIMD, very large caches) 152,000,000 ^[13] 2003 DEC 180 nm 397 mm ² 383,000 AMD K7Barton (32-bit, large cache) 54,300,000 2003 AMD 130 nm 101 mm ² 538,000 AMD K8 (64-bit, large cache) 105,900,000 2003 AMD 130 nm 193 mm ² 548,700 Pentium M Banias (32-bit) 77,000,000 ^[68] 2003 Intel 130 nm 83 mm ² 928,000 Itanium 2 President 6M (64-bit) 410,000,000 2003 Intel 130 nm 374 mm ² 1,096,000 PlayStation 2 single chip (CPU + GPU) 53,500,000 ^[69] 2003 ^[70] Sony, Toshiba 90 nm ^[71]
130 nm ^{[72] [73]} 86 mm ² 622,100 Pentium 4 Prescott (32-bit, unprofessional cache) 112,000,000 2004 Intel 90 nm 110 mm ² 1,018,000 Pentium M Dothan (32-bit) 144,000,000 ^[74] 2004 Intel 90 nm 87 mm ² 1,655,000 SPARC64 V+ (64-bit, large cache) 400,000,000 ^[75] 2004 Fujitsu 90 nm 294 mm ² 1,360,000 Itanium 2 (64-bit;9 MB cache) 592,000,000 2004 Intel 130 nm 432 mm ² 1,370,000 Pentium 4 Prescott-2M (32-bit, large cache) 169,000,000 2005 Intel 90 nm 143 mm ² 1,182,000 Pentium D Smithfield (64-bit, large cache) 228,000,000 2005 Intel 90 nm 206 mm ² 1,107,000 Xenon (64-bit, 128-bit SIMD, large cache) 165,000,000 2005 IBM 90 nm ? ? Cell (32-bit, cache) 250,000,000 ^[76] 2005 Sony, IBM, Toshiba 90 nm 221 mm ² 1,131,000 Pentium 4 Wood Mill (32-bit, large cache) 184,000,000 2006 Intel 65 nm 90 mm ² 2,044,000 Pentium D Presler (64-bit, large cache) 362,000,000 ^[77] 2006 Intel 65 nm 162 mm ² 2,235,000 Core 2 Doublet Conroe (dual-core 64-bit, bulky caches) 291,000,000 2006 Intel 65 nm 143 mm ² 2,035,000 Dual-core Itanium 2 (64-bit, SIMD, large caches) 1,700,000,000 ^[78] 2006 Intel 90 nm 596 mm ² 2,852,000 AMD K10 quad-core 2M L3 (64-bit, large caches) 463,000,000 ^[79] 2007 AMD 65 nm 283 mm ² 1,636,000 ARM Cortex-A9 (32-bit, (optional) SIMD, caches) 26,000,000 ^[80] 2007 ARM 45 nm 31 mm ² 839,000 Core 2 Duo Wolfdale (dual-core 64-bit, SIMD, caches) 411,000,000 2007 Intel 45 nm 107 mm ² 3,841,000 POWER6 (64-bit, large caches) 789,000,000 2007 IBM 65 nm 341 mm ² 2,314,000 Core 2 Duo Allendale (dual-core 64-bit, SIMD, chunky caches) 169,000,000 2007 Intel 65 nm 111 mm ² 1,523,000 Uniphier 250,000,000 ^[81] 2007 Matsushita 45 nm ? ? SPARC64 VI (64-bit, SIMD, large caches) 540,000,000 2007 ^[82] Fujitsu 90 nm 421 mm ² 1,283,000 Core 2 Duo Wolfdale 3M (dual-core 64-bit, SIMD, large caches) 230,000,000 2008 Intel 45 nm 83 mm ² 2,771,000 Core i7 (quad-core 64-bit, SIMD, large caches) 731,000,000 2008 Intel 45 nm 263 mm ² 2,779,000 AMD K10 quad-core 6M L3 (64-bit, SIMD, large caches) 758,000,000 ^[79] 2008 AMD 45 nm 258 mm ² 2,938,000 Atom (32-bit, large cache) 47,000,000 2008 Intel 45 nm 24 mm ² 1,958,000 SPARC64 Heptad (64-bit, SIMD, large caches) 600,000,000 2008 ^[83] Fujitsu 65 nm 445 mm ² 1,348,000 Six-core Xeon 7400 (64-bit, SIMD, cavernous caches) 1,900,000,000 2008 Intel 45 nm 503 mm ² 3,777,000 Six-core Opteron 2400 (64-bit, SIMD, large caches) 904,000,000 2009 AMD 45 nm 346 mm ² 2,613,000 SPARC64 VIIIfx (64-bit, SIMD, large caches) 760,000,000 ^[84] 2009 Fujitsu 45 nm 513 mm ² 1,481,000 Atom (Pineview) 64-bit, 1-core, 512 kB L2 store 123,000,000 ^[85] 2010 Intel 45 nm 66 mm ² 1,864,000 Atom (Pineview) 64-bit, 2-core, 1 Gash L2 cache 176,000,000 ^[86] 2010 Intel 45 nm 87 mm ² 2,023,000 SPARC T3 (16-core 64-bit, SIMD, large caches) 1,000,000,000 ^[87] 2010 Sun/Oracle 40 nm 377 mm ² 2,653,000 Six-core Core i7 (Gulftown) 1,170,000,000 2010 Intel 32 nm 240 mm ² 4,875,000 POWER7 32M L3 (8-core 64-bit, SIMD, chunky caches) 1,200,000,000 2010 IBM 45 nm 567 mm ² 2,116,000 Quad-core z196 ^[88] (64-bit, very necessary caches) 1,400,000,000 2010 IBM 45 nm 512 mm ² 2,734,000 Quad-core Itanium Tukwila (64-bit, SIMD, large caches) 2,000,000,000 ^[89] 2010 Intel 65 nm 699 mm ² 2,861,000 XeonNehalem-EX (8-core 64-bit, SIMD, large caches) 2,300,000,000 ^[90] 2010 Intel 45 nm 684 mm ² 3,363,000 SPARC64 IXfx (64-bit, SIMD, large caches) 1,870,000,000 ^[91] 2011 Fujitsu 40 nm 484 mm ² 3,864,000 Quad-core + GPUCore i7 (64-bit, SIMD, large caches) 1,160,000,000 2011 Intel 32 nm 216 mm ² 5,370,000 Six-core Foundation i7/8-core Xeon E5
(Sandy Bridge-E/EP) (64-bit, SIMD, crackdown caches) 2,270,000,000 ^[92] 2011 Intel 32 nm 434 mm ² 5,230,000 XeonWestmere-EX (10-core 64-bit, SIMD, lax caches) 2,600,000,000 2011 Intel 32 nm 512 mm ² 5,078,000 Atom "Medfield" (64-bit) 432,000,000 ^[93] 2012 Intel 32 nm 64 mm ² 6,750,000 SPARC64 Limitation (64-bit, SIMD, caches) 2,990,000,000 ^[94] 2012 Fujitsu 28 nm 600 mm ² 4,983,000 AMD Bulldozer (8-core 64-bit, SIMD, caches) 1,200,000,000 ^[95] 2012 AMD 32 nm 315 mm ² 3,810,000 Quad-core + GPU AMD Trinity (64-bit, SIMD, caches) 1,303,000,000 2012 AMD 32 nm 246 mm ² 5,297,000 Quad-core + GPU Core i7 Ivy Go across (64-bit, SIMD, caches) 1,400,000,000 2012 Intel 22 nm 160 mm ² 8,750,000 POWER7+ (8-core 64-bit, SIMD, 80 MB L3 cache) 2,100,000,000 2012 IBM 32 nm 567 mm ² 3,704,000 Six-core zEC12 (64-bit, SIMD, large caches) 2,750,000,000 2012 IBM 32 nm 597 mm ² 4,606,000 Itanium Poulson (8-core 64-bit, SIMD, caches) 3,100,000,000 2012 Intel 32 nm 544 mm ² 5,699,000 Xeon Phi (61-core 32-bit, 512-bit SIMD, caches) 5,000,000,000 ^[96] 2012 Intel 22 nm 720 mm ² 6,944,000 Apple A7 (dual-core 64/32-bit ARM64, "mobile SoC", SIMD, caches) 1,000,000,000 2013 Apple 28 nm 102 mm ² 9,804,000 Six-core Core i7 Vine Bridge E (64-bit, SIMD, caches) 1,860,000,000 2013 Intel 22 nm 256 mm ² 7,266,000 POWER8 (12-core 64-bit, SIMD, caches) 4,200,000,000 2013 IBM 22 nm 650 mm ² 6,462,000 Xbox Combine main SoC (64-bit, SIMD, caches) 5,000,000,000 2013 Microsoft, AMD 28 nm 363 mm ² 13,770,000 Quad-core + GPU Core i7 Haswell (64-bit, SIMD, caches) 1,400,000,000 ^[97] 2014 Intel 22 nm 177 mm ² 7,910,000 Apple A8 (dual-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 2,000,000,000 2014 Apple 20 nm 89 mm ² 22,470,000 Core i7 Haswell-E (8-core 64-bit, SIMD, caches) 2,600,000,000 ^[98] 2014 Intel 22 nm 355 mm ² 7,324,000 Apple A8X (tri-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 3,000,000,000 ^[99] 2014 Apple 20 nm 128 mm ² 23,440,000 Xeon Vine Bridge-EX (15-core 64-bit, SIMD, caches) 4,310,000,000 ^[100] 2014 Intel 22 nm 541 mm ² 7,967,000 Xeon Haswell-E5 (18-core 64-bit, SIMD, caches) 5,560,000,000 ^[101] 2014 Intel 22 nm 661 mm ² 8,411,000 Quad-core + GPU GT2 Join together i7 Skylake K (64-bit, SIMD, caches) 1,750,000,000 2015 Intel 14 nm 122 mm ² 14,340,000 Dual-core + GPU Iris Core i7 Broadwell-U (64-bit, SIMD, caches) 1,900,000,000 ^[102] 2015 Intel 14 nm 133 mm ² 14,290,000 Apple A9 (dual-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 2,000,000,000+ 2015 Apple 14 nm
(Samsung) 96 mm ²
(Samsung) 20,800,000+ 16 nm
(TSMC) 104.5 mm ²
(TSMC) 19,100,000+ Apple A9X (dual core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 3,000,000,000+ 2015 Apple 16 nm 143.9 mm ² 20,800,000+ IBM z13 (64-bit, caches) 3,990,000,000 2015 IBM 22 nm 678 mm ² 5,885,000 IBM z13 Storage Somebody 7,100,000,000 2015 IBM 22 nm 678 mm ² 10,472,000 SPARC M7 (32-core 64-bit, SIMD, caches) 10,000,000,000 ^[103] 2015 Oracle 20 nm ? ? Core i7 Broadwell-E (10-core 64-bit, SIMD, caches) 3,200,000,000 ^[104] 2016 Intel 14 nm 246 mm ^{2 [105]} 13,010,000 Apple A10 Fusion (quad-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 3,300,000,000 2016 Apple 16 nm 125 mm ² 26,400,000 HiSilicon Kirin 960 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 4,000,000,000 ^[106] 2016 Huawei 16 nm 110.00 mm ² 36,360,000 Xeon Broadwell-E5 (22-core 64-bit, SIMD, caches) 7,200,000,000 ^[107] 2016 Intel 14 nm 456 mm ² 15,790,000 Xeon Phi (72-core 64-bit, 512-bit SIMD, caches) 8,000,000,000 2016 Intel 14 nm 683 mm ² 11,710,000 Accommodate oneself to CPU (32-bit, for FPGAs) 1,286 6-LUTs ^[108] 2016 Gisselquist Technology ? ? ? Qualcomm Snapdragon 835 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 3,000,000,000 ^{[109] [110]} 2016 Qualcomm 10 nm 72.3 mm ² 41,490,000 Apple A11 Bionic (hexa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 4,300,000,000 2017 Apple 10 nm 89.23 mm ² 48,190,000 AMD Zen CCX (core intricate unit: 4 cores, 8 MB L3 cache) 1,400,000,000 ^[111] 2017 AMD 14 nm
(GF 14LPP) 44 mm ² 31,800,000 AMD Aircraft SoC Ryzen (64-bit, SIMD, caches) 4,800,000,000 ^[112] 2017 AMD 14 nm 192 mm ² 25,000,000 AMD Ryzen 5 1600 Ryzen (64-bit, SIMD, caches) 4,800,000,000 ^[113] 2017 AMD 14 nm 213 mm ² 22,530,000 IBM z14 (64-bit, SIMD, caches) 6,100,000,000 2017 IBM 14 nm 696 mm ² 8,764,000 IBM z14 Storage Controller (64-bit) 9,700,000,000 2017 IBM 14 nm 696 mm ² 13,940,000 HiSilicon Kirin 970 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 5,500,000,000 ^[114] 2017 Huawei 10 nm 96.72 mm ² 56,900,000 Xbox One X (Project Scorpio) main SoC (64-bit, SIMD, caches) 7,000,000,000 ^[115] 2017 Microsoft, AMD 16 nm 360 mm ^{2 [115]} 19,440,000 Xeon Platinum 8180 (28-core 64-bit, SIMD, caches) 8,000,000,000 ^[116] 2017 Intel 14 nm ? ? Xeon (unspecified) 7,100,000,000 ^[117] 2017 Intel 14 nm 672 mm ² 10,570,000 POWER9 (64-bit, SIMD, caches) 8,000,000,000 2017 IBM 14 nm 695 mm ² 11,500,000 Freedom U500 Base Platform Chip (E51, 4×U54) RISC-V (64-bit, caches) 250,000,000 ^[118] 2017 SiFive 28 nm ~30 mm ² 8,330,000 SPARC64 Dozen (12-core 64-bit, SIMD, caches) 5,450,000,000 ^[119] 2017 Fujitsu 20 nm 795 mm ² 6,850,000 Apple A10X Fusion (hexa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 4,300,000,000 ^[120] 2017 Apple 10 nm 96.40 mm ² 44,600,000 Centriq 2400 (64/32-bit, SIMD, caches) 18,000,000,000 ^[121] 2017 Qualcomm 10 nm 398 mm ² 45,200,000 AMD Epyc (32-core 64-bit, SIMD, caches) 19,200,000,000 2017 AMD 14 nm 768 mm ² 25,000,000 Qualcomm Snapdragon 845 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 5,300,000,000 ^[122] 2017 Qualcomm 10 nm 94 mm ² 56,400,000 Qualcomm Snapdragon 850 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 5,300,000,000 ^[123] 2017 Qualcomm 10 nm 94 mm ² 56,400,000 HiSilicon Kirin 710 (octa-core ARM64 "mobile SoC", SIMD, caches) 5,500,000,000 ^[124] 2018 Huawei 12 nm ? ? Apple A12 Bionic (hexa-core ARM64 "mobile SoC", SIMD, caches) 6,900,000,000
^{[125] [126]} 2018 Apple 7 nm 83.27 mm ² 82,900,000 HiSilicon Kirin 980 (octa-core ARM64 "mobile SoC", SIMD, caches) 6,900,000,000 ^[127] 2018 Huawei 7 nm 74.13 mm ² 93,100,000 Qualcomm Snapdragon 8cx / SCX8180 (octa-core ARM64 "mobile SoC", SIMD, caches) 8,500,000,000 ^[128] 2018 Qualcomm 7 nm 112 mm ² 75,900,000 Apple A12X Bionic (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 10,000,000,000 ^[129] 2018 Apple 7 nm 122 mm ² 82,000,000 Fujitsu A64FX (64/32-bit, SIMD, caches) 8,786,000,000 ^[130] 2018 ^[131] Fujitsu 7 nm ? ? Tegra Missionary SoC (64/32-bit) 9,000,000,000 ^[132] 2018 Nvidia 12 nm 350 mm ² 25,700,000 Qualcomm Snapdragon 855 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 6,700,000,000 ^[133] 2018 Qualcomm 7 nm 73 mm ² 91,800,000 AMD Zen 2 centre (0.5 MB L2 + 4 MB L3 cache) 475,000,000 ^[134] 2019 AMD 7 nm 7.83 mm ² 60,664,000 AMD Foolhardy 2 CCX (core complex: 4 cores, 16 Preview L3 cache) 1,900,000,000 ^[134] 2019 AMD 7 nm 31.32 mm ² 60,664,000 AMD Zen 2 CCD (core complex die: 8 cores, 32 MB L3 cache) 3,800,000,000 ^[134] 2019 AMD 7 nm 74 mm ² 51,350,000 AMD Zen 2 client I/O die 2,090,000,000 ^[134] 2019 AMD 12 nm 125 mm ² 16,720,000 AMD Zen 2 server I/O die 8,340,000,000 ^[134] 2019 AMD 12 nm 416 mm ² 20,050,000 AMD Zen 2 Renoir give way 9,800,000,000 ^[134] 2019 AMD 7 nm 156 mm ² 62,820,000 AMDRyzen 7 3700X (64-bit, SIMD, caches, I/O die) 5,990,000,000 ^{[135] [e]} 2019 AMD 7 & 12 nm
(TSMC) 199 
(74+125) mm ² 30,100,000 HiSilicon Kirin 990 4G 8,000,000,000 ^[136] 2019 Huawei 7 nm 90.00 mm ² 89,000,000 Apple A13 (hexa-core 64-bit ARM64 "mobile SoC", SIMD, caches) 8,500,000,000
^{[137] [138]} 2019 Apple 7 nm 98.48 mm ² 86,300,000 IBM z15 CP chip (12 cores, 256 MB L3 cache) 9,200,000,000 ^[139] 2019 IBM 14 nm 696 mm ² 13,220,000 IBM z15 SC chip (960 Analysis L4 cache) 12,200,000,000 2019 IBM 14 nm 696 mm ² 17,530,000 AMDRyzen 9 3900X (64-bit, SIMD, caches, I/O die) 9,890,000,000
^{[140] [141]} 2019 AMD 7 & 12 nm
(TSMC) 273 mm ² 36,230,000 HiSilicon Kirin 990 5G 10,300,000,000 ^[142] 2019 Huawei 7 nm 113.31 mm ² 90,900,000 AWS Graviton2 (64-bit, 64-core ARM-based, SIMD, caches) ^{[143] [144]} 30,000,000,000 2019 Amazon 7 nm ? ? AMD Epyc Rome (64-bit, SIMD, caches) 39,540,000,000
^{[140] [141]} 2019 AMD 7 & 12 nm
(TSMC) 1,008 mm ² 39,226,000 Qualcomm Snapdragon 865 (octa-core 64/32-bit ARM64 "mobile SoC", SIMD, caches) 10,300,000,000 ^[145] 2019 Qualcomm 7 nm 83.54 mm ^{2 [146]} 123,300,000 TI Jacinto TDA4VM (ARM A72, DSP, SRAM) 3,500,000,000 ^[147] 2020 Texas Mechanism 16 nm ? ? Apple A14 Bionic (hexa-core 64-bit ARM64 "mobile SoC", SIMD, caches) 11,800,000,000 ^[148] 2020 Apple 5 nm 88 mm ² 134,100,000 Apple M1 (octa-core 64-bit ARM64 SoC, SIMD, caches) 16,000,000,000 ^[149] 2020 Apple 5 nm 119 mm ² 134,500,000 HiSilicon Kirin 9000 15,300,000,000
^{[150] [151]} 2020 Huawei 5 nm 114 mm ² 134,200,000 AMD Zen 3 CCX (core complex unit: 8 cores, 32 MB L3 cache) 4,080,000,000 ^[152] 2020 AMD 7 nm 68 mm ² 60,000,000 AMD Zen 3 CCD (core complex die) 4,150,000,000 ^[152] 2020 AMD 7 nm 81 mm ² 51,230,000 Core 11th gen Rise rapidly Lake (8-core 64-bit, SIMD, large caches) 6,000,000,000+ ^[153] 2021 Intel 14 nm +++ 14 nm 276 mm ^{2 [154]} 37,500,000 or 21,800,000+ ^[155] AMD Ryzen 7 5800H (64-bit, SIMD, caches, I/O plus GPU) 10,700,000,000 ^[156] 2021 AMD 7 nm 180 mm ² 59,440,000 AMD Epyc 7763 (Milan) (64-core, 64-bit) ? 2021 AMD 7 & 12 nm
(TSMC) 1,064 mm ²
(8×81+416) ^[157] ? Apple A15 15,000,000,000
^{[158] [159]} 2021 Apple 5 nm 107.68 mm ² 139,300,000 Apple M1 Pro (10-core, 64-bit) 33,700,000,000 ^[160] 2021 Apple 5 nm 245 mm ^{2 [161]} 137,600,000 Apple M1 Max (10-core, 64-bit) 57,000,000,000
^{[162] [160]} 2021 Apple 5 nm 420.2 mm ^{2 [163]} 135,600,000 Power10 dual-chip module (30 SMT8 cores or 60 SMT4 cores) 36,000,000,000 ^[164] 2021 IBM 7 nm 1,204 mm ² 29,900,000 Dimensity 9000 (ARM64 SoC) 15,300,000,000
^{[165] [166]} 2021 Mediatek 4 nm
(TSMC N4) ? ? Apple A16 (ARM64 SoC) 16,000,000,000
^{[167] [168] [169]} 2022 Apple 4 nm ? ? Apple M1 Extreme (dual-chip module, 2×10 cores) 114,000,000,000
^{[170] [171]} 2022 Apple 5 nm 840.5 mm ^{2 [163]} 135,600,000 AMD Epyc 7773X (Milan-X) (multi-chip module, 64 cores, 768 MB L3 cache) 26,000,000,000 + Milan ^[172] 2022 AMD 7 & 12 nm
(TSMC) 1,352 mm ²
(Milan + 8×36) ^[172] ? IBM Telum dual-chip module (2×8 cores, 2×256 MB cache) 45,000,000,000
^{[173] [174]} 2022 IBM 7 nm (Samsung) 1,060 mm ² 42,450,000 Apple M2 (deca-core 64-bit ARM64 SoC, SIMD, caches) 20,000,000,000 ^[175] 2022 Apple 5 nm ? ? Dimensity 9200 (ARM64 SoC) 17,000,000,000
^{[176] [177] [178]} 2022 Mediatek 4 nm
(TSMC N4P) ? ? Qualcomm Snapdragon 8 Gen 2 (octa-core ARM64 "mobile SoC", SIMD, caches) 16,000,000,000 2022 Qualcomm 4 nm 268 mm ² 59,701,492 AMD EPYC Genoa (4th gen/9004 series) 13-chip module (up be 96 cores and 384 MB (L3) + 96 MB (L2) cache) ^[179] 90,000,000,000
^{[180] [181]} 2022 AMD 5 nm (CCD)
6 nm (IOD) 1,263.34 mm ²
12×72.225 (CCD)
396.64 (IOD)
^{[182] [183]} 71,240,000 HiSilicon Kirin 9000s 9,510,000,000 ^[184] 2023 Huawei 7 nm 107 mm ² 107,690,000 Apple M4 (deca-core 64-bit ARM64 SoC, SIMD, caches) 28,000,000,000 ^[185] 2024 Apple 3 nm ? ? Apple M3 (octa-core 64-bit ARM64 SoC, SIMD, caches) 25,000,000,000 ^[186] 2023 Apple 3 nm ? ? Apple M3 Pro (dodeca-core 64-bit ARM64 SoC, SIMD, caches) 37,000,000,000 ^[186] 2023 Apple 3 nm ? ? Apple M3 Max (16-core 64-bit ARM64 SoC, SIMD, caches) 92,000,000,000 ^[186] 2023 Apple 3 nm ? ? Apple A17 19,000,000,000
^[187] 2023 Apple 3 nm 103.8 mm ² 183,044,315 Sapphire Rapids quad-chip module (up to 60 cores and 112.5 Jumble of cache) ^[188] 44,000,000,000–
48,000,000,000 ^[189] 2023 Intel 10 nm ESF (Intel 7) 1,600 mm ² 27,500,000–
30,000,000 Apple M2 Pro (12-core 64-bit ARM64 SoC, SIMD, caches) 40,000,000,000 ^[190] 2023 Apple 5 nm ? ? Apple M2 Max (12-core 64-bit ARM64 SoC, SIMD, caches) 67,000,000,000 ^[190] 2023 Apple 5 nm ? ? Apple M2 Die-hard (two M2 Max dies) 134,000,000,000 ^[6] 2023 Apple 5 nm ? ? AMD Epyc Bergamo (4th gen/97X4 series) 9-chip final (up to 128 cores and 256 MB (L3) + 128 MB (L2) cache) 82,000,000,000 ^[191] 2023 AMD 5 nm (CCD)
6 nm (IOD) ? ? AMD Instinct MI300A (multi-chip module, 24 cores, 128 GB GPU memory + 256 MB (LLC/L3) cache) 146,000,000,000 ^{[192] [193]} 2023 AMD 5 nm (CCD, GCD)
6 nm (IOD) 1,017 mm ² 144,000,000 In britain director Transistor misinformation Year Designer Process
(nm) Area (mm ² ) Transistor
density
(tr./mm ² )